<owl:Class xmlns="https://folio.openlegalstandard.org/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:v1="http://www.loc.gov/mads/rdf/v1#" xmlns:owl="http://www.w3.org/2002/07/owl#" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:xsd="http://www.w3.org/2001/XMLSchema#" xmlns:folio="https://folio.openlegalstandard.org/" xmlns:rdfs="http://www.w3.org/2000/01/rdf-schema#" xmlns:skos="http://www.w3.org/2004/02/skos/core#" rdf:about="https://folio.openlegalstandard.org/KGk7MTllQTqINOS9v-pCyg">
  <rdfs:subClassOf rdf:resource="https://folio.openlegalstandard.org/rm6Op71TRZKqO_wE7EHJEA"/>
  <rdfs:isDefinedBy rdf:resource="https://www.naics.com/six-digit-naics/?code=333242"/>
  <rdfs:label>Semiconductor Machinery Manufacturing</rdfs:label>
  <skos:definition>This U.S. industry comprises establishments primarily engaged in manufacturing wafer processing equipment, semiconductor assembly and packaging equipment, and other semiconductor making machinery.</skos:definition>
</owl:Class>